Softbank raises USD320m in bond offering

21 Jul 2009

Japanese fixed, mobile and broadband provider Softbank Corp has raised JPY30 billion (USD320 million) through a BBB-rated bond offering to institutional investors. It is understood the Tokyo-based telco priced three-year, 4.72% notes to yield four percentage points more than the yen swap rate, according to data provided by Bloomberg. Softbank will use money raised from the securities to repay debt, it said in a filing with Japan’s finance ministry today.

Japan, SoftBank Group Corp